LX700 - Mainframe

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LX700 - Modular Signal Processing System

Six years in planning and development, the LX700™ is the direct result of customer feedback for numerous features, capabilities, and performance requests. Designed to enable high flexibility and expandability, the LX700 provides a highly cost effective solution to a wide variety of applications.

Today, everyone wants more for less. Consumers want less costly products that deliver greater functionality. Likewise, instrumentation products must offer greater value and capabilities for today's demanding markets.

The LX700 system was designed to be highly generalized to cover many measurement application market segments including both lab R&D and production QC/QA testing. The software includes a Macro programming script capability to enable users to create custom automated test programs for production line testing.

The module family will be expanded over time and will include: analog, digital, and mixed mode measurements, analog/digital automation control, signal multiplexers, spectrum analyzers, signal generators, impedance analyzers, amplifiers, various metering, and DSP development tools. Numerous measurements can be performed including spectral analysis, distortion analysis, arbitrary waveform and signal generation, and much more.

Features
• Modular System
• User Configurable
• User Expandable
• High Density Design
• Cost Effective Design
• Multiple Mainframe Support
• 7 Module Bays per Mainframe
• High Speed 32bit Internal Bus
• Ethernet Computer Interface
• USB Computer Interface
• GPIB/IEEE-488 Interface
• Large Scale Array Measurement
• Windows® Application Software
• Application Specific Features
• Worldwide Operation 85-265VAC
• Portable Operation 24VDC
• 2 Rack Space Chassis
• Lightweight 12lb Chassis
• Efficient Design & Construction

Modular Flexibility

The modular architecture of the LX700 system enables the user to configure a measurement system with capabilities that exactly meet their needs, for a vast array of different kinds of applications. Moreover, the system can be easily expanded, changed, or reconfigured in the future at substantially reduced cost over stand alone instruments.

To conserve materials, labor, and overall cost, a highly efficient high density module design was created with maximum space and materials utilization. Each module is formed from a single PC board and a single metal front panel. The PC board employs a card edge connector pattern at the rear, and the front panel contains dual custom captive screw fasteners to secure the module. The module bays are individually shielded and contain card guides for self alignment and easy module insertion.